HyperLight introduced what it calls the industry’s first 110 GHz IQ packaged modulators, advancing the capabilities of its TFLN Chiplet platform for next-generation coherent systems and advanced testing environments. The devices deliver operational bandwidth up to 125 GHz and support 240 GBaud signaling, with shipments already underway to customers worldwide.
The new modulators achieve a record low half-wave voltage of 1.7 V, optimized for the limited voltage swing of high-baud-rate Arbitrary Waveform Generators (AWG). They include coverage across C/L- and O-bands and an optional automatic bias controller designed for TFLN thermal phase shifters. Applications span 240 GBaud coherent testing and 110 GHz single sideband modulation.
HyperLight said the launch builds on its portfolio of ultra-high-speed electro-optic devices, including 110 GHz Intensity and Phase modulators. The company continues to leverage thin-film lithium niobate (TFLN) to deliver high-bandwidth, energy-efficient optical components for data centers, AI, telecom, and quantum applications.
• 125 GHz operational bandwidth
• Supports 240 GBaud-class transmission
• Record low half-wave voltage of 1.7 V
• Single-polarization IQ modulator with C/L- and O-band support
• Automatic bias controller available
“With 240 GBaud coherent applications on the horizon, the launch of our 110 GHz IQ Modulator gives customers early and straightforward access to the golden transmitters essential for next-generation coherent testing and development,” said Mian Zhang, CEO of HyperLight.
🌐 Analysis: This announcement highlights the continued momentum of thin-film lithium niobate (TFLN) in pushing coherent optics to higher baud rates. HyperLight’s 110 GHz portfolio complements ongoing work across the industry on 224G and 448G standards, and positions the company against rivals advancing silicon photonics and indium phosphide platforms. With coherent optics central to scaling AI and data center interconnects, these devices mark a significant step toward commercial adoption of 240 GBaud systems.
HyperLight Corporation is a Cambridge, Massachusetts–based startup (with R&D roots at Harvard) focused on building a scalable integrated photonics platform based on thin-film lithium niobate (TFLN) to power next-generation telecom, data center, AI, and sensing applications. Under co-founder and CEO Mian Zhang, who previously did research in photonics and optoelectronics (including at Harvard) and with Christian Reimer serving as cofounder and Head of Product, bringing deep optics / nonlinear photonics experience, the company is working to commercialize high-performance electro-optic modulators and photonic integrated circuits with low loss, high bandwidth, and manufacturability.
HyperLight’s core technology is its TFLN photonic integration platform and chiplet architecture, enabling dense, low-power optical circuits and modulators that aim to relieve bottlenecks in optical interconnects. In March 2025, the company announced a TFLN Chiplet™ platform supporting scalable 6-inch production with roadmap expansion to 8-inch wafers.
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