HyperLight, a start-up based in Cambridge, Mass., that I developing thin film lithium niobate (TFLN) photonic integrated circuits (PICs), has secured $37 million in Series B funding led by Summit Partners, with participation from existing investors Xora Innovation and Foothill Ventures. This investment will accelerate HyperLight’s product development to meet the growing demand for high-performance, energy-efficient PICs in AI/data centers, telecommunications, and high-performance computing. HyperLight’s TFLN technology addresses the limitations of current PIC materials by offering unmatched bandwidth and power efficiency. The funding enables the company to scale its production-ready supply chain and expand its product offerings for next-generation optical communication infrastructure. Peter Chung, CEO of Summit Partners, will join HyperLight’s Board of Directors.
• Investment: $37 million Series B funding
• Lead investor: Summit Partners
• Co-investors: Xora Innovation, Foothill Ventures
• Key technology: Thin film lithium niobate (TFLN) PICs
• Applications: AI/data centers, telecom optical networks, high-performance computing
“We believe TFLN will be the photonics platform of the future and identified HyperLight as an emerging category leader,” said Peter Chung, CEO of Summit Partners.
“We are thrilled to welcome Summit Partners as a new investor given their capabilities and deep experience in photonics, including investments in E-TEK Dynamics, Finisar, MACOM and Acacia Communications,” said Mian Zhang, President and CEO of HyperLight Corporation. “This financing round, supported by investors with demonstrated experience in the photonics industry, will enhance our ability to serve the current and future needs of our customers as a trusted innovation partner. We are ready to serve the industry with high-speed and energy-efficient photonic IC solutions designed to enable the network of the future.”
