IBM unveiled a prototype optical transceiver chipset capable of reaching 160 Gbps. To achieve this new level of integration in the chipset, IBM researchers built an optical transceiver with driver and receiver integrated circuits in current CMOS technology. They then coupled it with other necessary optical components made in more exotic materials, such as indium phosphide (InP) and gallium arsenide (GaAs), into one, integrated package only 3.25 by 5.25 millimeters in size. 
IBM said its compact design provides both a high number of communications channels as well as very high speeds per channel, resulting in an amount of information transmitted per unit area of card space taken up by the chipset (the ultimate measure of viability for practical use) that is the highest ever. This transceiver chipset is designed to enable low cost optics by attaching to an optical printed circuit board employing densely spaced polymer waveguide channels using mass assembly processes.
http://www.ibm.com
