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Home » II-VI tapes out DSP for 100 Gbps coherent optical access

II-VI tapes out DSP for 100 Gbps coherent optical access

June 7, 2022
in Optical, Semiconductors
A A

by James E. Carroll

II‐VI has taped-out its Steelerton digital signal processor (DSP) for 100 Gbps coherent transmission in optical access and aggregation networks.  

The company says its Steelerton DSP, miniaturized and with ultralow power dissipation, typically of 2 W, was designed specifically to enable 100 Gbps digital coherent optics (DCO) in a pluggable QSFP28 format, one of the most widely deployed 100 Gbps transceiver form factors in access networks.

“The Steelerton DSP promises to bring 100 Gbps QSFP28-DCO transceivers into the mainstream in access networks,” said Matthias Berger, Vice President, Coherent Technology, II-VI Incorporated. “It’s a breakthrough solution that enables wide-scale deployment of full C-band tunable coherent transceivers into QSFP28 ports, of which there are tens of millions in service. The Steelerton DSP is less than one-fifth the size and consumes less than half the power of any other 100 Gbps coherent DSP commercially available.”

https://ii-vi.com/news/ii-vi-incorporated-develops-ultralow-power-dsp-for-100-gbps-coherent-transmission-in-optical-access-networks/

ADVA and II-VI debut 100ZR pluggable coherent transceiver

Tuesday, June 21, 2022  ADVA, II-VI  

ADVA and II‐VI introduced a jointly-built, 100ZR pluggable coherent transceiver for the optical network edge.The new Coherent 100ZR, which is rated for both commercial- and industrial-temperature (C-temp and I-temp) operating ranges, features the II-VI Steelerton coherent digital signal processor (DSP). The device plugs directly into existing head-ends, switches, and routers, enabling existing network elements to transmit 100 Gbps signals over links…

READ MORE

IFS makes a splash: $1B fund, Arm & RISC-V support, Open Chiplet Platform 

Monday, February 07, 2022  Intel, Silicon  

by James E. CarrollThe newly established Intel Foundry Services (IFS) announced several initiatives to accelerate its entrance into the semiconductor fabrication market: a $1 billion investment fund, support for Arm and RISC-V in addition to x86, and pioneering work with chiplet architecture based on 3D packaging technology.The new $1 billion investment fund has three aims:Equity investments in disruptive startups.Strategic investments to accelerate…

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