Intel has been awarded Phase Three of the U.S. Department of Defense’s (DoD) Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) program. This development marks a crucial step in testing and deploying defense industrial base (DIB) product prototypes. Announced via the National Security Technology Accelerator’s consortium-based program, this phase emphasizes Intel’s readiness in process technology and the ability to meet high-volume manufacturing demands with its Intel 18A technology.
The latest phase of RAMP-C allows for the commencement of manufacturing both commercial and DIB product prototypes using Intel’s advanced 18A process technology. Kapil Wadhera, Intel’s vice president for Foundry Services and general manager of the Government Engagements and Business Operations Group, noted that for the first time in decades, U.S. government and defense customers will access leading-edge technology concurrently with commercial markets.
RAMP-C is strategically designed to reinstate the U.S. as a leader in cutting-edge semiconductor technology by fostering a robust, resilient, and trusted commercial foundry ecosystem. Here are some key points about the program and Intel’s involvement:
Phase Three Focus: Extensive testing of DIB product prototypes using Intel 18A process technology. Collaboration: Intel Foundry works with major industry players such as Microsoft, Nvidia, IBM, and others to support the design and manufacturing of advanced integrated circuits. Future Milestones: Dr. Dev Shenoy of the DoD highlighted that RAMP-C aims to showcase prototype production on Intel 18A by 2025, significantly enhancing processing capabilities for military applications. Security and Performance: The program addresses the critical need for secure and highly performant microelectronics in U.S. military systems. Industry Integration: Intel has created the U.S. Military, Aerospace, and Government (USMAG) Alliance to ensure functional and operational security requirements are met through a dedicated semiconductor IP ecosystem.
