Intel Foundry reported progress from several ecosystem partners on its Embedded Multi-die Interconnect Bridge (EMIB) technology, which is designed used to connect multiple silicon dies within a single package, allowing for high-bandwidth communication between them without the need for traditional interposers. EMIB enables the integration of different types of dies, such as CPUs, GPUs, and other specialized processors, in a compact and efficient manner, improving performance and reducing latency. It is particularly useful in creating advanced multi-die systems that require high data transfer rates and efficient power usage.
Intel’s EMIB technology has already been proven in Intel’s own microprocessors, including the Intel GPU Max Series (code-named Ponte Vecchio), 4th Gen Intel Xeon and Xeon 6 processors, and Intel Stratix 10 FPGAs.
The company now reports that key EDA and IP partners are making progress with EMIB packaging technology for their projects. Announcements from ecosystem partners this week include:
- Ansys is collaborating with Intel Foundry to deliver signoff verification of thermal and power integrity and mechanical reliability of Intel’s EMIB technology spanning advanced silicon process nodes to various heterogenous packaging platforms.
- Cadence announced the availability of a complete EMIB 2.5D packaging flow, digital and custom/analog flows for Intel 18A, and design IP for Intel 18A.
- Siemens also announced the availability of an EMIB reference flow for Intel Foundry’s customers. This is in addition to their announcement of Solido Simulation Suite certification for custom IC verification on Intel 16, Intel 3, and Intel 18A nodes.
- Synopsys announced the availability of its AI-driven multi-die reference flow for Intel Foundry’s EMIB advanced packaging technology, accelerating the development of multi-die designs.
“Today’s news shows how Intel Foundry continues to combine the best of Intel with the best of our ecosystem to help our customers realize their AI systems ambitions,” stated Suk Lee, vice president for Ecosystem Development, Intel Foundry.
