Intel highlighted two new advanced packaging and test technologies for its foundry customers.
Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, is a simpler 2.5D packaging approach for very high density interconnects between heterogeneous dies on a single package.
Intel said this technology embeds a small silicon bridge chip in the package, enabling very high density die-to-die connections only where needed. Standard flip-chip assembly is used for robust power delivery and to connect high-speed signals directly from chip to the package substrate.
Intel also announced the availability of its revolutionary High Density Modular Test (HDMT) platform for markets including server, client, system on chip, and Internet of Things. Until now, this capability was only available internally for Intel products.
