At CES 2025, Intel introduced its Core Ultra 200 series processors, featuring enhanced AI performance, power efficiency, and a diverse range of options for both mobile and desktop users. Alongside the new processors, Intel provided updates on its next-generation manufacturing technologies, including progress on the Intel 18A process node, designed to deliver higher transistor density and efficiency for future products.
The Core Ultra 200V series, tailored for business laptops, integrates Intel vPro for AI-driven productivity, hardware-enhanced security, and improved battery efficiency. The Core Ultra 200HX and 200H processors target creators and gamers with up to 24 cores, integrated Arc graphics, and a neural processing unit (NPU) for AI acceleration. Desktop users benefit from the expanded Core Ultra 200S lineup with 12 new processors, while the Core Ultra 200U offers mainstream mobile performance with power efficiency. Intel also announced its Intel 18A process node has begun sampling, with volume production expected in the second half of 2025.
• Core Ultra 200V: Business-class processors with Intel vPro, hardware security, AI productivity features, and extended battery life.
• Core Ultra 200HX and 200H: Up to 24 cores (8 Performance + 16 Efficient), integrated Arc graphics, and an NPU for AI tasks and creative workloads.
• Core Ultra 200U: Mainstream mobile processors with efficiency-focused performance.
• Core Ultra 200S: Expanded desktop lineup with 12 new models (65W and 35W options).
• Intel 18A Node: Next-gen process technology with enhanced transistor density and power efficiency, now sampling with volume production planned for late 2025.
• Edge Computing: New processors optimized for AI workloads, including the Core Ultra 200S/H/U series and Core 100U series.
“Intel Core Ultra processors are setting new benchmarks for mobile AI and graphics, once again demonstrating the superior performance and efficiency of the x86 architecture as we shape the future of personal computing,” said Michelle Johnston Holthaus, interim co-CEO and CEO of Intel Products.
