• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Saturday, April 11, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Intel expands its manufacturing plans

Intel expands its manufacturing plans

January 24, 2022
in Semiconductors
A A

Intel will invest more than $20 billion in the construction of two new fabs in Ohio. The initial phase of the project is expected to create 3,000 Intel jobs and 7,000 construction jobs over the course of the build. Air Products, Applied Materials, LAM Research and Ultra Clean Technology will establish a physical presence in the region. Initial production is targetted for 2025.

Today’s investment marks another significant way Intel is leading the effort to restore U.S. semiconductor manufacturing leadership,” said Pat Gelsinger, CEO of Intel. “Intel’s actions will help build a more resilient supply chain and ensure reliable access to advanced semiconductors for years to come. Intel is bringing leading capability and capacity back to the United States to strengthen the global semiconductor industry.

In a press conference, Gelsinger said the new facilities will produced advanced chip designs at 2nm and below.

“The impact of this mega-site investment will be profound,” said Keyvan Esfarjani, Intel senior vice president of Manufacturing, Supply Chain and Operations. “A semiconductor factory is not like other factories. Building this semiconductor mega-site is akin to building a small city, which brings forth a vibrant community of supporting services and suppliers. Ohio is an ideal location for Intel’s U.S. expansion because of its access to top talent, robust existing infrastructure, and long history as a manufacturing powerhouse. The scope and pace of Intel’s expansion in Ohio, however, will depend heavily on funding from the CHIPS Act.”

https://www.intel.com/content/www/us/en/newsroom/resources/global-manufacturing.html#gs.mt8qf9

Intel breaks ground on $20 billion fabs in AZ

Friday, September 24, 2021  Intel, Silicon  

Intel broke ground on two new fabs (52 and 62) at the company’s Ocotillo campus in Chandler, Arizona. When fully operational in 2024, the new fabs will manufacture Intel’s most advanced process technologies, including Intel 20A featuring the new RibbonFET and PowerVia innovations. The capacity is expected to be used for Intel’s own products as well as for customers of the newly formed Intel Foundry Services.“Today’s celebration marks an important…

READ MORE

TSMC to invest $12 billion in 5nm fab in Arizona

Friday, May 15, 2020  Silicon, TSMC  

TSMC confirmed plans to build and operate an advanced semiconductor fab in Arizona — its secend manufacturing site in the United States. The company already operates a fab in Camas, Washington and design centers in Austin and San Jose. The new facility in Arizona represents a $12 billion investment. It will utilize TSMC’s 5-nanometer technology for semiconductor wafer fabrication, have a 20,000 semiconductor wafer per month capacity. TSMC said…

READ MORE

GlobalFoundries plans new $1 billion fab expansion in New York

Wednesday, July 21, 2021  GlobalFoundries, NY/NJ, Silicon  

GlobalFoundries (GF) announced its expansion plans for its most advanced manufacturing facility in upstate New York.GF will invest $1 billion to immediately add an additional 150,000 wafers per year within its existing Fab 8 to help address the global chip shortage. Following that, GF plans to construct a new fab that will create more than 1,000 new high-tech jobs. GF recently announced new fab in Singapore and $1 billion planned investment…

READ MORE

Samsung ramps up automotive memory chips for EVs

Wednesday, December 15, 2021  Automotive, Samsung, SSD  

Samsung Electronics unveiled a portfolio of automotive memory solutions designed for next-generation autonomous electric vehicles. The new lineup includes a 256-gigabyte (GB) PCIe Gen3 NVMe ball grid array (BGA) SSD, 2GB GDDR6 DRAM and 2GB DDR4 DRAM for high-performance infotainment systems, as well as 2GB GDDR6 DRAM and 128GB Universal Flash Storage (UFS) for autonomous driving systems.The need for high-capacity, high-performance SSDs and graphics…

READ MORE


Tags: IntelSilicon
ShareTweetShare
Previous Post

Dell’Oro: Open RAN on track

Next Post

Ray Stata, co-founder of Analog Devices, to step down as chairman

Staff

Staff

Related Posts

Intel Q3 2025: AI Partnerships, Foundry Momentum, and U.S. Backing 
All

Intel Q3 2025: AI Partnerships, Foundry Momentum, and U.S. Backing 

October 23, 2025
Intel Ramps 18A Production at Fab 52
Semiconductors

Intel Ramps 18A Production at Fab 52

October 9, 2025
Intel Foundry Services forms USMAG Alliance
Semiconductors

NVIDIA and Intel Forge $5B Partnership to Build Data Center and PC Chips

September 18, 2025
Intel’s Q3 data center revenue dropped 27% yoy
Financials

Intel Names New Data Center, Client, and Foundry Leaders

September 8, 2025
Intel cites progress with U.S. fabs
Semiconductors

U.S. Takes 9.9% Stake in Intel with $8.9B Equity Investment

August 22, 2025
Intel breaks ground on its new fab in Ohio
Financials

Intel Posts Flat Revenue for Q2, Restructuring and Impairments

July 24, 2025
Next Post
Ray Stata, co-founder of Analog Devices, to step down as chairman

Ray Stata, co-founder of Analog Devices, to step down as chairman

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version