NTT DOCOMO, NEC, Panasonic Mobile Communications and Fujitsu are joining forces to develop the software and hardware intellectual property for a single large-scale integration (LSI) chip that will enable small, energy-efficient modems to support the GSM, W-CDMA, HSPA+ and LTE mobile standards.
The first prototype chips has already been taped out and tested.
All mobile broadband standards supported by the chip meet 3GPP specifications. The LTE standard supports FDD (Frequency Division Duplexing) mode adopted by DOCOMO and TDD (Time Division Duplexing) mode expected to be adopted for LTE networks in China and other markets, which will help to further the development of advanced mobile devices by manufacturers worldwide.
The four partners, in addition to other major players in the mobile technology field, working through a joint venture currently being planned, aim to commercialize the chip in Japan and other countries as quickly as possible. A follow-up chip supporting LTE-Advanced is also being planned. http://www.nec.co.jp
