Keysight Technologies has launched the Electrical Structural Tester (EST), a cutting-edge wire bond inspection solution aimed at improving the reliability of semiconductor components in high-volume manufacturing. The EST utilizes advanced capacitive-based test technology to detect subtle wire bond defects that traditional methods might miss, such as wire sag, near shorts, and stray wires. This new solution addresses critical testing challenges in industries where chip integrity is paramount, including automotive and medical devices.
The EST offers several key benefits:
• Advanced defect detection: Uses capacitive coupling analysis to identify a wide range of wire bond defects, both electrical and non-electrical.
• High throughput: Capable of testing up to 20 integrated circuits simultaneously, allowing for a production rate of up to 72,000 units per hour.
• Big data analytics integration: Enhances yield and defect capture with advanced methods like marginal retry test (MaRT), dynamic part averaging test (DPAT), and real-time part averaging test (RPAT).
“Keysight is dedicated to pioneering innovative solutions that address the most pressing challenges in the wire bonding process,” said Carol Leh, Vice President of Keysight’s Electronic Industrial Solutions Group Center of Excellence. “The Electrical Structural Tester empowers chip manufacturers to enhance production efficiency by rapidly identifying wire bond defects, ensuring superior quality and reliability in high-volume manufacturing.”
