MACOM Technology Solutions has demonstrated interoperability of Broadcom’s PAM-4 DSP and its transimpedance amplifiers (TIAs) for 53 Gbps per lane VCSEL based short reach and 100 Gbps per lane EML based long reach data center applications.
The pairing for single-mode long reach solutions includes Broadcom’s 7nm Centenario DSP (BCM874xx) with MACOM’s four-channel 4×106 Gbps PAM-4 linear transimpedance amplifiers (TIAs) optimized for use in 400G and 800G DR4 and FR4 optical modules. The MATA-03819, MATA-03820 and MATA-03821 are available in flip chip and wire bonding options, respectively, for fast, flexible deployment of QSFP-DD and OSFP optical modules.
The pairing for multi-mode short reach solutions includes Broadcom’s 7nm Estoque DSP (BCM875xx) with MACOM’s two-chip analog solution for 200 Gbps and 400 Gbps short reach SR4 and SR8 modules (QSFP, OSFP, QSFP-DD) and Active Optical Cable (AOC) applications in the data center.
The MACOM chipset consists of two devices, the MATA-38434 4×53 Gbps PAM-4 TIA and MATA-38435 4×53 Gbps PAM-4 VCSEL driver, that deliver IEEE standard specified performance and are compliant with Open Eye MSA eye mask specifications.
“Our customers require high-performance solutions to enable their data center applications,” said Marek Tlalka, Senior Director, High-Performance Analog, MACOM. “This collaboration offers the industry another proof point towards the interoperability of DSPs to MACOM’s TIA portfolio, and a path to shorter design cycle for 400G and 800G module manufacturers.”
“Broadcom’s 7nm DSPs along with MACOM’s TIAs provides industry-leading performance at the lowest power for 200G/400G/800G optical modules,” said Khushrow Machhi, Senior Director of Marketing, Physical Layer Products Division, Broadcom. “Additionally these various modules show the interoperability of Broadcom’s DSP with various components needed to develop industry-leading optical modules.”
