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Home » MACOM Launches 227 Gbps Equalizers for High-Speed Copper and 1.6 Tbps Networks

MACOM Launches 227 Gbps Equalizers for High-Speed Copper and 1.6 Tbps Networks

January 28, 2025
in Semiconductors
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MACOM Technology Solutions has announced the production availability of its 227 Gbps per lane linear equalizers, designed to enhance active copper cable (ACC) applications for high-performance computing clusters. These new devices extend the reach of traditional twinax Direct Attach Cables (DAC), which face transmission limitations at 227 Gbps per lane. By more than doubling the reach of DAC cables, MACOM enables longer 1.6 Tbps copper cable assemblies for intra-rack connectivity in high-speed data centers.

The MACOM MAEQ-40904 (die solution) and MAEQ-40914 (packaged version) employ un-retimed, analog equalization techniques, reducing power consumption and link latency compared to retimed copper or active electrical cables (AEC). These equalizers are optimized for high-density applications and support a variety of cable connector form factors, including DSFP, QSFP, QSFP-DD, OSFP, and OSFP-XD. Additionally, they can be used in on-board applications to improve signal integrity and extend PCB trace lengths. MACOM will showcase these solutions at DesignCon 2025, along with its expanded PURE DRIVE™ 200 Gbps per Lane Linear Drive and PCIe-over-Fiber technology demonstrations.

“With 227 Gbps per lane technology, MACOM continues to push the boundaries of high-speed copper and optical connectivity,” stated a company representative. “Our linear equalizers enable the development of efficient, low-latency 1.6 Tbps copper links, supporting the increasing demands of AI and data-intensive workloads.” These advancements align with MACOM’s commitment to delivering power-efficient and scalable semiconductor solutions for data centers and next-generation networking.

• MACOM launches 227 Gbps per lane linear equalizers for 1.6 Tbps copper connectivity.

• Extends the reach of DAC cables, reducing reliance on AEC and retimed copper solutions.

• Supports various high-density form factors, including QSFP, QSFP-DD, OSFP, and OSFP-XD.

• Showcased at DesignCon 2025 alongside MACOM PURE DRIVE™ and PCIe-over-Fiber demos.

• Enables lower power, low-latency data transmission for AI and high-performance computing.

“With 227 Gbps per lane technology, MACOM continues to push the boundaries of high-speed copper and optical connectivity. Our linear equalizers enable the development of efficient, low-latency 1.6 Tbps copper links, supporting the increasing demands of AI and data-intensive workloads.”

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