MACOM introduced four new 200G-per-lane optical solutions aimed at supporting the emerging 1.6Tbps connectivity demands of next-generation data centers. These high-performance components include 100 mW and 75 mW Continuous Wave (CW) lasers, optimized specifically for DR4 and DR8 silicon photonics (SiPh) optical modules. Utilizing MACOM’s proprietary Etched Facet Technology (EFT), these lasers are available as single-channel units or as multi-channel arrays in 8-channel and 16-channel configurations.
Additionally, MACOM unveiled the MARP-BP112 backside-illuminated photodiode (PD) featuring an integrated lens, designed to be stacked directly onto the company’s transimpedance amplifiers (TIAs), enhancing overall system efficiency, thermal management, and reducing assembly complexity and cost.
Complementing these innovations, MACOM introduced the MALD-40435 VCSEL driver optimized for 200G-per-lane short-reach multi-mode fiber (MMF) modules and Active Optical Cables (AOCs), providing efficient interface spacing at 250 µm between VCSEL channels. MACOM will demonstrate these products at OFC 2025 in San Francisco, highlighting their comprehensive solutions for scaling optical interconnects to meet growing demands for high-speed, efficient data center connectivity.
• MACOM launches new 200G-per-lane components for 1.6Tbps optical connectivity in data centers.
• New 100 mW and 75 mW CW lasers for DR4 and DR8 silicon photonics modules available in single-channel and array formats.
• MARP-BP112 backside-illuminated PD with integrated lens enables stacking on TIAs for improved performance and efficiency.
• MALD-40435 VCSEL driver provides optimized 250 µm channel spacing for MMF optical modules and AOCs.
• New products showcased at OFC 2025 in San Francisco.
“These new additions represent significant enhancements to MACOM’s optical solutions portfolio, addressing critical high-speed connectivity requirements as data centers scale to 1.6Tbps applications,” stated MACOM.
