Marvell released a 1.6 Tbps transimpedance amplifier (TIA) and laser driver chipset, enabling 800 Gbps and 1.6 Tbps linear-drive pluggable optics (LPO) for short-reach compute fabric interconnects. The new chipset addresses the limitations of passive direct-attached copper (DAC) cables, offering a scalable and power-efficient solution for next-generation data center networks requiring 200 Gbps per lane connectivity.
As AI-driven workloads increase bandwidth demands, compute fabric networks connecting XPUs within and across racks require faster, longer-reach solutions than DAC cables can provide. Marvell’s LPO chipset bridges this gap with advanced TIA and laser driver technology, supporting longer distances, higher bandwidth, and improved energy efficiency. This addition complements Marvell’s broader interconnect portfolio, which includes PAM4 and coherent DSPs, active electrical cables, and PCIe retimers, offering cloud operators tailored solutions for every layer of the network.
• Bandwidth: Supports 200 Gbps per lane, enabling 800 Gbps and 1.6 Tbps LPO modules.
• Efficiency: Reduces module design complexity, power consumption, and total cost of ownership (TCO).
• Performance: Features best-in-class linearity, power, and bit error rate (BER) for AI applications.
• Scalability: Provides adjustable equalization to address channel loss in short-reach interconnects.
• Integration: Complements Marvell’s 1.6 Tbps connectivity portfolio for both optical and copper solutions.
“As AI-driven data centers continue to scale, optimizing interconnect solutions across each layer of the network is becoming increasingly critical,” said Xi Wang, Vice President of Product Marketing for Optical Connectivity at Marvell. “Our LPO chipset addresses the growing demand for short-reach, high-bandwidth solutions, providing a critical technology to enable next-generation AI clusters.”
