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Home » MediaTek expands Wi-Fi 7 Chipset portfolio

MediaTek expands Wi-Fi 7 Chipset portfolio

November 19, 2023
in 5G / 6G / Wi-Fi, Semiconductors
A A

MediaTek introduced its Filogic 860 and Filogic 360 chipsets supporting Wi-Fi 7. Sampling is underway.

Filogic 860 combines a Wi-Fi 7 dual-band access point with a new advanced network processor solution and is ideal for enterprise access points, service provider Ethernet gateways and mesh nodes, as well as retail and IoT router applications. 

The Filogic 860 platform key features:

  • 6nm low power Wi-Fi design
  • Single-MAC MLO support
  • Supports 4096-QAM and MRU
  • Supports dual-band Wi-Fi 7 with industry-highest dual-band MLO speed, 7.2Gbps
  • Dual-band, dual concurrent capabilities with 4T4R for 2.4GHz up to BW40 and 5T5R 4SS for 5GHz up to BW160
  • Support for an additional receive antenna for zero-wait DFS
  • Filogic Xtra range support, boosting receiving distance using an extra antenna
  • Filogic 360 is a stand-alone client solution that integrates Wi-Fi 7 2×2 and dual Bluetooth 5.4 radios in a single chip, and is designed to deliver next-generation Wi-Fi 7 connectivity to edge devices, streaming devices and a vast array of other consumer electronics.
  •  

Key features of the Filogic 360 include:

  • * Triple-band selectable Wi-Fi 7 2×2 with up to 2.9Gbps speed
  • Supports 4096-QAM and MRU * 160MHz channel bandwidth support
  • Filogic Xtra range support, boosting communication distance by unique Hybrid MLO solution
  • Support for dual Bluetooth 5.4 cores for gaming and other applications
  • BLE audio with integrated DSP for LC3 codec support
  • MediaTek advanced Wi-Fi and Bluetooth coexistence technology ensures both technologies can operate on the 2.4 GHz band seamlessly, without interference
Amazon previews Wi-Fi 7 mesh system
Source: Mediatek
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Jim Carroll

Jim Carroll

Editor and Publisher, Converge! Network Digest, Optical Networks Daily - Covering the full stack of network convergence from Silicon Valley

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