• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Saturday, April 11, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » MIT: a new technique for assembling on-chip optics and electronics separately

MIT: a new technique for assembling on-chip optics and electronics separately

April 24, 2018
in All
A A

A team of researchers led by groups at MIT, the University of California at Berkeley, and Boston University, have developed a technique for assembling on-chip optics and electronics separately using existing manufacturing processes.

The work, which is described in an article in the latest issue of Nature, allows the addition of optical communication components onto chips with modern transistors.

“The most promising thing about this work is that you can optimize your photonics independently from your electronics,” says Amir Atabaki, a research scientist at MIT’s Research Laboratory of Electronics and one of three first authors on the new paper. “We have different silicon electronic technologies, and if we can just add photonics to them, it’d be a great capability for future communications and computing chips. For example, now we could imagine a microprocessor manufacturer or a GPU manufacturer like Intel or Nvidia saying, ‘This is very nice. We can now have photonic input and output for our microprocessor or GPU.’ And they don’t have to change much in their process to get the performance boost of on-chip optics.”

http://news.mit.edu/2018/integrating-optical-components-existing-chip-designs-0419

Tags: AcademiaBlueprint columnsMITSilicon Photonics
ShareTweetShare
Previous Post

NTT develops new QoE technique in video streaming

Next Post

Coriant achieves EcoVadis Gold for the 2nd consecutive year

Staff

Staff

Related Posts

CBRE Group acquires Direct Line Global for data center infrastructure
Optical

NYU Researchers Discover Hybrid Liquid-Crystal Material 

November 8, 2025
DustPhotonics Debuts 1.6T and 800G 2xFR4 Chips
All

DustPhotonics Debuts 1.6T and 800G 2xFR4 Chips

April 2, 2025
Openlight samples its 2x FR4 Photonic ASIC
Optical

OpenLight Partners with DoplayDo to Streamline Silicon Photonics Design

January 28, 2025
Jefferson Lab and ESnet Stream Physics Data Coast-to-Coast at 100 Gbps
All

Jefferson Lab and ESnet Stream Physics Data Coast-to-Coast at 100 Gbps

September 24, 2024
Silicon Photonics Industry Alliance Gets Underway, Backed by TSMC
Optical

Silicon Photonics Industry Alliance Gets Underway, Backed by TSMC

September 4, 2024
NTT and Okayama University show gigahertz ultrasonic circuit
5G / 6G / Wi-Fi

NTT and Okayama University show gigahertz ultrasonic circuit

July 22, 2024
Next Post
Coriant achieves EcoVadis Gold for the 2nd consecutive year

Coriant achieves EcoVadis Gold for the 2nd consecutive year

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version