Molex has acquired core technology and intellectual property (IP) from Keyssa Inc. regarding wireless chip-to-chip technology. The deal encompasses over 350 filed patent applications. Financial terms were not disclosed.
The acquired technology operates at data rates up to 6 Gbps on the 60 GHz band with no WiFi or Bluetooth interference.
Molex says the tiny, low-power, low-latency, solid-state contactless connectors can solve critical data transmission needs with minimal overhead. Molex plans to advance these current capabilities by supporting exponentially higher data rates and full-duplex communications. Additionally, Molex will leverage its longstanding signal integrity expertise and mmWave antenna capabilities to speed the commercialization of new contactless connectors while complementing its existing portfolio of products.
Molex also will take advantage of the Virtual Pipe I/O (VPIO) technology Keyssa developed to resolve protocol inefficiencies. By aggregating low- and high-speed protocols for simultaneous transmission over one or more links, VPIO can help compensate for real-time events that impact link performance integrity. Used in combination, VPIO and contactless connectors can create extensible and efficient I/O that is free from the limitations of mechanical connectors while being capable of adapting and scaling as dictated by application demands.
“Keyssa’s wireless chip-to-chip technology complements Molex’s developments in mmWave antenna connectivity to meet the growing demands for high data rate transmissions,” said Justin Kerr, vice president and general manager, Micro Solutions Business Unit, Molex. “We constantly push the technology envelope for our mobile and consumer device customers, offering greater product design freedom while supporting next-generation wireless connectivity needs.”
