Molex agreed to acquire Smiths Interconnect, a division of the UK-based Smiths Group plc, in a move that broadens its capabilities across the aerospace, defense, semiconductor, industrial, and medical sectors. The deal, expected to close in the first half of 2026 pending regulatory approval, follows Molex’s November 2024 acquisition of AirBorn and reinforces its push into high-reliability connectivity markets.
Smiths Interconnect designs and manufactures microwave, optical, and RF components for mission-critical systems, serving customers in aerospace and defense as well as medtech and semiconductor testing. The company operates 21 facilities in 12 countries, including the United States, the United Kingdom, Germany, Italy, China, and Singapore. Combining Smiths Interconnect’s specialized engineering and Molex’s global scale aims to accelerate innovation and extend Molex’s footprint across high-growth technology domains.
“This acquisition strongly enhances the platform established by our acquisition of AirBorn,” said Joe Nelligan, CEO of Molex. “Together, we’ll expand our aerospace and defense business and support customers in new and innovative ways.”
- Transaction expected to close in H1 2026, subject to regulatory approval
- Smiths Interconnect operates in 12 countries with 21 global sites
- Molex recently expanded its defense footprint with the AirBorn acquisition
- Rothschild & Co served as Molex’s exclusive financial advisor; Jones Day acted as legal counsel
🌐 Analysis: This move deepens Molex’s integration into high-reliability sectors where performance and resilience are paramount, positioning it closer to major defense primes and aerospace OEMs. It also builds momentum behind Molex’s medtech and semiconductor initiatives, leveraging synergies from Koch Industries’ broader industrial and technology portfolio. Rival players such as TE Connectivity and Amphenol have made similar expansions in ruggedized interconnect markets.
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