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Home » Motorola and TI Expands Relationship to High-Volume 3G, WiMAX and OMAP

Motorola and TI Expands Relationship to High-Volume 3G, WiMAX and OMAP

January 28, 2007
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Motorola and Texas Instruments are expanding their strategic relationship to include 3G, WiMAX and OMAP technologies in the design and development of new, experience-optimized mobile devices. The expanded relationship covers current, emerging and next-generation wireless standards and leverages intellectual property from both Motorola and TI.

As part of the expansion, Motorola is developing 3G handsets based on a TI customized 3G solution that will include high-performance, power-efficient processors from TI’s OMAP 3 architecture, as well as advanced, unique 3G and 3.5G building blocks from both Motorola and TI. New handsets using this solution are expected to be available to consumers as early as 2008.

Additionally, TI is supporting Motorola’s mobile WiMAX initiative, including development of a customized Motorola WiMAX solution, and providing digital design elements, high-performance analog components, RF solutions, and manufacturing process and fabrication expertise. The solution will focus on core 802.16e mobile WiMAX functionality supporting voice, video and data for low-power mobile applications. The solution will be manufactured in 65nm and is expected to be ready to support production of new mobile devices that Motorola plans to launch during 2008.

http://www.motorola.com

http://www.ti.com/wirelesspressroom

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