NeoPhotonics began sampling its new 400ZR ClearLight OSFP transceiver to a leading cloud -related customer.
The new transceiver utilizes NeoPhotonics Silicon Photonics Coherent Optical Subassembly (COSA) and low power consumption, ultra-narrow linewidth Nano-ITLA tunable laser, combined with the latest generation of 7 nm DSP, to provide full 400ZR transmission in a standard data center OSFP form factor.
NeoPhotonics said its new 400ZR ClearLight OSFP transceiver can be plugged directly into switches and router, simplifying data center interconnect (DCI) networks by eliminating a layer of network equipment and a set of short reach client-side transceivers. The new OSFP module is capable of tuning to 75 GHz or 100GHz spaced wavelength channels, as specified in the OIF agreement, and operates in 400ZR mode for Cloud DCI applications. For longer metro reaches, the module is designed to support 400ZR+ modes.
This ClearLight OSFP module can also be optionally provisioned to tune over the entire “Super C-Band”, or up to 6.4 Terahertz, increasing the capacity of an optical fiber by up to 50% over standard implementations. NeoPhotonics provides arrayed waveguide gratings for multiplexing and de-multiplexing with 75GHz and 100GHz wavelength channel spacings, supporting 85 and 64 channels respectively, with filter responses optimized for high baud rate coherent signals.
“This new OSFP module joins our ClearLightTM DCO transceiver line and takes full advantage of our highly integrated and low power consumption Nano-Tunable Laser and Silicon Photonics COSA to enable a full metro coherent transceiver in the form factor and electrical interface designed for short reach interconnections inside the data center,” said Tim Jenks, Chairman and CEO of NeoPhotonics. “We are now sampling these OSFP transceivers so that customers can evaluate the simplicity, cost and operating savings that can be realized by plugging coherent optics directly into switches and routers, and we are applying this same technology to additional form factors such as QSFP-DD”, concluded Mr. Jenks.
OIF readies 400ZR, CEI-112G and IC-TROSA demos
Twelve OIF member companies will stage a multi-vendor interoperability demonstration of 400ZR, Common Electrical I/O (CEI)-112G and IC-TROSA at the upcoming ECOC 2019 trade show in Dublin, Ireland later this month.
Participating companies include ADVA, Amphenol, Cadence Design System, Credo, Finisar, Inphi, Keysight Technologies, Marvell, Molex, MultiLane, TE Connectivity and YAMAICHI ELECTRONICS will participate in the demonstration in OIF’s booth, # 441.
400ZR & IC-TROSA Demo
OIF’s 400ZR project aims to reduce cost and complexity reduction for 400GbE over 80 km DWDM networks. The IC-TROSA features all of the optical building blocks for a coherent module in a single package. The demonstrations will highlight important aspects of IC-TROSA integration as well as real-time EVM measurements with the updated script for 400ZR. In addition, a hardware-based 400ZR installation will show a typical application case.
CEI-112G Demo
OIF is taking a lead role in moving the industry to the next generation with its development of electrical interface specifications for 112 Gbps per differential pair. Multiple live demonstrations featuring interoperability clearly prove the key role OIF provides. The CEI-112G demonstrations in the OIF booth will feature multi-party silicon supplier interoperability over mated compliance board channels, a full host to module channel and direct attach copper cable channels, all demonstrating the technical viability of 112 Gbps operation, along with multiple industry form factors including OSFP and QSFP-DD.
“Understanding and seeing first-hand how key technologies – 400ZR, CEI-112G and IC-TROSA – are each specified to enable interoperable deployment across the ecosystem is critically important to building market confidence and accelerating adoption,” said Steve Sekel, OIF Physical and Link Layer Interoperability Working Group Chair. “This showcase of 12 companies and key technologies is a clear representation of OIF’s leadership in driving electrical, optical and control interoperability.”
