• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Sunday, April 12, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » OCP 2019: Microsoft’s Project Zipline offers better data compression

OCP 2019: Microsoft’s Project Zipline offers better data compression

March 15, 2019
in All
A A

At OCP 2019, Microsoft unveiled Project Zipline, a new compression standard for data sets covering Edge to Cloud app.

Project Zipline promises “compression without compromises where always-on procession achieves high compression ratios with high throughput and low latency. Zipline encompasses algorithms, software, and silicon engines.

Microsoft estimates Zipline data set sizes at 4 ~ 8% of uncompressed sizes. Over time, Microsoft anticipates Project Zipline compression technology will make its way into network data processing, smart SSDs, archival systems, cloud appliances, general purpose microprocessor, IoT, and edge devices.

A number of big name silicon and storage companies are already on board as partners.

https://azure.microsoft.com/en-us/blog/hardware-innovation-for-data-growth-challenges-at-cloud-scale/

Tags: Blueprint columnsOCP
ShareTweetShare
Previous Post

OCP 2019: Arista’s 12.8Tbps switch developed with Facebook

Next Post

OCP 2019: Facebook rethinks data center fabric

Staff

Staff

Related Posts

Open Compute Project names Rebecca Weekly of Intel as new Chair
Data Centers

OCP Names Zane Ball CTO, Russ Wunderlich Principal Hardware Engineer

August 13, 2025
OCP releases Bunch of Wires (BoW) spec for chiplet interconnect
Semiconductors

OCP Unveils Universal Link Layer Spec to Boost Chiplet Interoperability

August 5, 2025
OCP Launches Optical Circuit Switching Subproject
Optical

OCP Launches Optical Circuit Switching Subproject

July 21, 2025
OCP releases Bunch of Wires (BoW) spec for chiplet interconnect
All

OCP Welcomes New Board Members from Meta, Microsoft and Intel

February 6, 2025
Jabil Expands Server Portfolio
Semiconductors

OCP Launches Chiplet Marketplace

October 17, 2024
Open Compute Project: Green Concrete for Data Centers
Data Centers

Open Compute Project: Green Concrete for Data Centers

August 21, 2024
Next Post
OCP 2019: Facebook rethinks data center fabric

OCP 2019: Facebook rethinks data center fabric

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version