The Open Compute Project Foundation (OCP) and JEDEC announced a collaboration to revolutionize chiplet design, manufacturing and integration.
In a significant development, the integration of OCP CDXML into JEP30 has reached a critical milestone, enabling chiplet builders to provide standardized chiplet part descriptions to their customers electronically. This advancement opens the door to automating System in Package (SiP) design and assembly using chiplets. The chiplet descriptions encompass crucial information for SiP builders, including thermal properties, physical and mechanical requirements, behavior specifications, power and signal integrity properties, testing in-package and security parameters.
The Chiplet Design Exchange (CDX), an open-source working group operating in the Open Domain-Specific Architecture (ODSA) sub-project within the Open Compute Project, comprises a team of experts from diverse fields, including EDA, system design, IC and SiP design, OSAT, IC fabrication and material supply. Their collective mission, and that of the OCP ODSA Project, revolves around nurturing a flourishing open chiplet economy. The CDX group presented a whitepaper at the IEEE 3DIC 2021 conference in October 2021, introducing standardized chiplet models designed for development and validation of 3D IC designs. While many of these models drew from established standards, a standout innovation emerged in the form of machine-readable models for electrical and mechanical properties, which have since evolved into the JEDEC JEP30 PartModels. These models form the foundation of a Chiplet Design Kit (CDK).
“The integration of JEDEC JEP30 and OCP CDXML is truly a groundbreaking endeavor, creating a unified platform that revolutionizes chiplet and electronic part integration,” said Michael Durkan, JEDEC Task Group Chair and PartModel Sponsor. He continued: “Enabling component manufacturers to create standardized digital part models that can be easily used by designers and engineers in all varieties of electronic systems will help propel the industry forward with next-level digitalization and automation.”
“By uniting the power of OCP CDXML and JEDEC JEP30 standards, we are forging a new era of collaboration and innovation in the chiplet industry. This integration empowers engineers, manufacturers and designers with a comprehensive framework that enhances efficiency, compatibility and customization,” said Cliff Grossner, Ph.D., Chief Innovation Officer with OCP. He added: “The OCP CDXML-JEDEC JEP30 collaboration embodies OCP’s value proposition and its commitment to driving progress and elevating the industry as a whole.”
