Check out OFC Conference and Exposition 2025 videos here: https://ngi.fyi/ofc25yt
How is Marvell revolutionizing rack-scale connectivity for next-gen data centers?
George Hervey, Principal Architect from Marvell explains:
– New co-package copper design moves high-speed escape to substrate top via flyover wires, extending passive copper life within racks
– 224G-ready liquid cooling solution enables efficient rack-scale deployment in 1U form factor
– Co-package optics technology allows scaling to 1000-2000 node clusters with single-layer switching across multiple racks
Want to be involved our video series? Contact info@nextgeninfra.io
https://ngi.fyi/ofc25-marvell-george
