How are optical interconnects evolving to meet AI and machine learning demands? What are the prospects for reducing energy demands?
Nathan Tracy, President from OIF explains:
– New energy-efficient interfaces and communication protocols are being developed for both optical and copper connections to optimize AI/ML fabric performance
– External laser solutions (ELSFP) are enabling co-packaged optical modules for next-generation architectures
– High-density switching implementations combine near-package and co-packaged connectivity options in both traditional and PCIe form factors
The video highlights live and conceptual demonstrations of next-generation EEI solutions for AI compute, along with live External Laser Small Form-Factor Pluggable (ELSFP) demos highlighting advancements in external laser sources critical for co-packaged architectures.
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