Ranovus is working with Cerebras Systems under a $45 million DARPA contract to develop a next-generation high-performance computing platform that integrates Ranovus’ wafer-scale co-packaged optics with Cerebras’ wafer-scale AI chips.
Hamid Arabzadeh, CEO from Ranovus explains:
– Wafer-scale co-package optics enables access to interfaces in the middle of multi-GPU wafers, advancing beyond single-die solutions
– The technology delivers two orders of magnitude more capacity compared to current 1.6 terabit/second optical engines
– This paves the way for massive compute scaling with unprecedented interconnect capabilities while reducing power consumption
Want to be involved our video series? Contact info@nextgeninfra.io
Check out OFC Conference and Exposition 2025 videos here: https://ngi.fyi/ofc25yt
