OIF’s CEI-224G framework project published a white paper summarizing the consensus findings and guidance for new OIF project starts for future CEI clauses addressing specific 224 Gbps reaches and architectures.
The whitepaper identifies key technical challenges for next-generation systems, defines electrical interconnection applications, and discusses some of the interoperability test challenges. This provides the OIF and other industry standards bodies with a common language and understanding of the development projects required for the next generation data rate systems. It also establishes baseline materials that will enable 1.6/3.2 Tbps rate architectures and lower cost, lower complexity 800 Gbps and 400 Gbps architectures.
“As demonstrated in the past, most recently at 112 Gbps, OIF plays a key role in driving industry activity to identify and develop critical technical solutions that will enable next-generation data rates to be cost-effectively deployed in future equipment and networks,” said Cathy Liu, Broadcom Inc., and OIF President.
“224 Gbps is going to bring many difficult challenges for the industry to address to achieve practical implementations in an interoperable way,” said Nathan Tracy, OIF VP of Marketing, TE Connectivity. “This Framework project and its resultant white paper align OIF members and industry on many of the key hurdles. Overcoming obstacles can be achieved by having consensus amongst a broad cross-section of component, subsystem and system suppliers to leverage new technologies that drive signaling, architecture and integration developments.”
OIF approves CEI-224G development project
OIF members have approved the CEI (Common Electrical I/O) 224G Development Project, the next electrical data rate beyond 112 Gbps. The expected result will be a technical white paper summarizing a consensus-based body of knowledge which will then enable several project starts for next generation CEI clauses addressing specific reaches and architectures. OIF’s recent quarterly virtual meeting also resulted in a wrap-up of the “Co-packaging…
