OIF published a framework Implementation Agreement (IA) for co-packaging of communication and computing interfaces with one or more ASICs. The document identifies critical co-packaged applications and their requirements and charting a path for interoperability standards.
The Co-Packaging track of OIF’s Physical & Link Layer (PLL) Working Group began by studying the application spaces contributed by the end-users. Then, it examined various related topics, including electrical and optical interfaces, thermal and mechanical considerations, reliability, safety, environmental and management interfaces. The findings of the work are summarized in the Framework Document IA.
OIF has initiated two follow-on co-packaging projects: External Laser Small Form Factor Pluggable (ELSFP) Project, announced in May 2021, and the 3.2T Module Project, announced in March 2021.
“OIF is leading industry discussion on this critical dense integration technology,” said Jeff Hutchins, Ranovus and OIF Board Member and PLL Working Group – Co-Packaging Vice Chair. “This framework IA provides the industry with a foundation for developing interoperable energy efficient co-packaged solutions.”
“Co-packaging represents a significant change to the way high-performance communications ASICs are packaged today,” said Technical Editor of the Co-Packaging Framework IA, Kenneth Jackson, Sumitomo Electric.
https://www.oiforum.com/oif-releases-co-packaging-framework-implementation-agreement/
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