OIF published a new Implementation Agreement (IA) for Common Electrical I/O (CEI) 5.0 specifying the next generation of 112 Gbps electrical interconnects. The IA specifies transmitter, receiver and channel requirements associated with Extra Short Reach (XSR), Medium Reach (MR) and Long Reach (LR) interfaces for multi-chip-module, chip-to-chip, and high-speed backplane applications.
“This IA marks a new generation of specifications for 112G interfaces,” said Klaus-Holger Otto, Nokia and OIF Technical Committee Chair. “It is a continuation of OIF’s proud history of adding next-generation data rates that enable broad interconnect solutions and are critical building blocks for several industry standards and platforms.”
“These new data rate specifications will enable applications including backplane, chip-to-chip, and die-to-die interfaces within a package,” said David Stauffer, Kandou Bus and Chair of OIF’s Physical and Link Layer (PLL) Working Group. “And, it enables multiple applications, such as co-packaged optics. Definitions of interfaces within co-packaged die are unique to this IA and OIF’s work.”
OIF advances 224G CEI
OIF launched four new CEI projects during its recent Q122 Technical and MA&E Committees meeting, which was held virtually in mid-February. These include:CEI-224G-Extra Short Reach (XSR) Common Electrical On-Package Interface Project, CEI-224G-Very Short Reach (VSR) Common Electrical Chip-to-Module Interface Project, CEI-224G-Medium Reach (MR) Common Electrical Chip-to-Chip Interface Project, CEI-224G-Long Reach (LR) Common Electrical…
OIF demos at at #OFC22: 400ZR interoperability; CPO; CEI-112, CMIS
OIF will host the following demonstrations at this year’s OFC 2022 in San Diego, March 8-10, 2022. Industry experts will also present updates on OIF’s current work in many critical areas, including 400ZR/800ZR and electrical rates.400ZR Demo – the first-ever public multivendor 400ZR consists of a full implementation of 400GE across an 80km, DWDM ecosystem using multiple module, router, open line systems, and test equipment vendors, demonstrating…
