OpenLight completed Telcordia GR-468 qualification for all active optoelectronic components in its Photonic Design Kit (PDK) based on Tower Semiconductor’s PH18DA process. The qualification certifies that OpenLight’s integrated lasers, electro-absorption modulators (EAMs), and photodiodes (PDs)—all based on Indium Phosphide (InP) technology—meet key industry reliability standards. The milestone strengthens OpenLight’s position as a key supplier of highly reliable silicon photonics components, which are critical for next-generation telecom, datacom, AI, HPC, LiDAR, and optical computing applications.
During GR-468 testing, OpenLight’s components exceeded standard benchmarks, with two test lots surpassing 5,000 hours and another exceeding 15,000 hours without failures, demonstrating exceptional long-term reliability. The qualification is a significant step toward the commercial scaling of OpenLight’s heterogeneously integrated photonics platform, which integrates InP-based lasers directly onto silicon wafers without requiring laser facets. This approach mitigates common failure modes like Catastrophic Optical Mirror Damage (COMD) and leverages superior single-epitaxial growth processes for enhanced material integrity.
OpenLight’s PASIC technology delivers monolithic integration of both active and passive photonics components on a single chip. With over 350 patents, the company is advancing next-gen photonics solutions for a wide array of industries. The GR-468 qualification also paves the way for wider adoption of OpenLight’s high-performance silicon photonics platform, reinforcing its leadership in a growing market for integrated optical technologies.
• OpenLight achieves GR-468 qualification for lasers, EAMs, and photodiodes in its silicon photonics platform.
• Components exceeded 15,000 hours of long-term reliability testing with no failures.
• Qualification based on Tower Semiconductor’s PH18DA process and InP integration.
• Technology eliminates laser facets to prevent COMD and uses single epitaxial growth for superior material integrity.
• OpenLight prepares for scaled deployment of its PASIC platform in AI, telecom, HPC, LiDAR, and optical computing.
“The successful GR-468 qualification and long-term reliability data will give our customers the confidence needed to transition to this next level of integration, opening the door for the widespread adoption of our high-performance components in Silicon Photonics,” said Dr. Adam Carter, CEO of OpenLight.
