Phononic introduced a high-performance solid-state thermoelectric module (TEM) designed to provide precise temperature control in order to meet the unique thermal management requirements of optoelectronics and fiber optic modules.
The new pico-TECs, which are manufactured using advanced automated semiconductor fabrication technology, have a device height of less than 0.7mm with a typical ΔT max of 65°K and a Qc max of 25 W/cm2 or more. In addition to the ultra-thin and ultra-small footprint, the pico-TECs offer accurate temperature control, reduce power consumption and application specific design options.
“This new generation of ultra-thin semiconductor technology removes barriers to miniaturization and enables higher data rates and operating speeds in a whole range of electronic applications,” said Michael J. Bruno, vice president and general manager of Phononic’s electronics cooling business unit. “Optoelectronics and fiber optic communication devices, such as Fiber To The X (FTTX), CATV and optical LAN requiring active cooling in an extreme form factor can immediately benefit from our pico-TECs.”
