Qualcomm introduced its fourth-generation 3G/LTE multimode modem chipset, the Qualcomm Gobi 9×35, and RF transceiver chip, the Qualcomm WTR3925.
The Qualcomm Gobi 9×35 is a cellular modem implemented in 20nm technology. It offers support for global carrier aggregation with up to 40 MHz for both LTE TDD and FDD Category 6. This enables download speeds of up to 300 Mbps. It is backwards compatible and supports all other major cellular technologies, including DC-HSPA, EVDO Rev. B, CDMA 1x, GSM and TD-SCDMA.
The Qualcomm WTR3925 is the first announced RF transceiver chip based on the 28 nm process, and is Qualcomm Technologies’ first single-chip, carrier aggregation RF solution that supports all carrier aggregation band combinations approved by 3GPP. The WTR3925 pairs with the Gobi 9×35 chipset and the Qualcomm RF360 Front End Solution, which enable the mobile industry’s premier global, single-SKU LTE platform. Sampling is expected to begin sampling early next year.
“We’re excited to be expanding our portfolio with a fourth generation of 3G/LTE multimode connectivity solutions,” said Cristiano Amon, executive vice president, Qualcomm Technologies, Inc., and co-president, QCT. “Not only do these products extend our industry-leading Gobi roadmap, they enable the creation of thinner and more efficient mobile devices capable of connecting to the fastest 4G LTE Advanced networks worldwide.”
