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Home » RAD Introduces G.SHDSL.bis for up to 22.8 Mbps over Bonded Copper

RAD Introduces G.SHDSL.bis for up to 22.8 Mbps over Bonded Copper

March 17, 2008
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RAD Data Communications has released its new ASMi-54 G.SHDSL.bis modem, which provides up to 22.8 Mbps of bandwidth using bonded copper pairs. The technology transmits multiple point-to-point links of up to 5.7 Mbps each, with each link synchronized at a different rate. The modem may be ordered with two, four or eight-wire options to yield a total bandwidth of 22.8 Mbps.

RAD Data Communications also noted that its ASMi-54 G.SHDSL.bis modem implements the IEEE’s 802.1p and 802.1q standards to provide VLAN tagging with four levels of prioritization, enabling carriers to offer differentiated Ethernet services. VLAN tagging can also be employed to separate traffic, ensuring transparency of the customer traffic and bolstering security of management traffic. http://www.rad.com

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