Rapidus, headquartered in Tokyo, and IBM announced a partnership focused on 2nm chiplet packaging technology. Rapidus will leverage IBM’s advanced semiconductor packaging technology. This partnership is part of a broader international collaboration under the framework of the New Energy and Industrial Technology Development Organization (NEDO).
As part of this partnership, Rapidus engineers will work alongside IBM at its North American packaging research and development facility. IBM, with its extensive experience in high-performance semiconductor packaging and collaborations with Japanese semiconductor manufacturers, will provide the expertise and support needed for Rapidus to expedite the development of advanced chiplet packaging technology. Rapidus aims to solidify Japan’s role in the semiconductor supply chain through this international collaboration.
Both Rapidus President Atsuyoshi Koike and IBM Senior Vice President and Research Director Darío Gil expressed their enthusiasm for this partnership. Koike emphasized the importance of this collaboration in enhancing Japan’s semiconductor packaging capabilities, while Gil highlighted IBM’s commitment to advancing chiplet technology and supporting new use cases and semiconductor talent development through this collaboration.
Key Points:
- Rapidus and IBM have partnered to develop 2nm chiplet packaging technology.
- The collaboration is part of NEDO’s international framework for semiconductor technology development.
- Rapidus engineers will work at IBM’s North American R&D facility.
- IBM brings extensive experience in high-performance semiconductor packaging.
- The partnership aims to enhance Japan’s role in the global semiconductor supply chain.
