The next generation of SD Express memory cards will use the well-known PCIe 3.0 specification and NVMe v1.3 protocols defined by PCI-SIG and NVM Express, respectively. The PCIe interface delivering a 985 megabytes per second (MB/s) maximum data transfer rate and the NVMe upper layer protocol enables advanced memory access mechanism, enabling a new world of opportunities for the popular SD memory card. In addition, the maximum storage capacity in SD memory cards grows from 2TB with SDXC to 128 TB with the new SD Ultra Capacity (SDUC) card. These innovations maintain the SDA’s commitment to backward compatibility and are part of the new SD 7.0 specification.
A new white paper, “SD Express Cards with PCIe and NVMe Interfaces,” provides more details on the new capabilities and features found in the SD 7.0 specification. More information is available on our website.
“With SD Express we’re offering an entirely new level of memory card with faster protocols turning cards into a removable SSD,” said Hiroyuki Sakamoto, SDA president. “SD 7.0 delivers revolutionary innovations to anticipate the needs of forthcoming devices and content rich and speed hungry applications.”
“PCI-SIG is pleased to have teamed with the SDA to collaborate on this innovation for the world’s leading removable memory card – SD,” said Al Yanes, PCI-SIG president and chairman. “PCIe specification conformance tests are available today by major test vendors, offering a significant advantage for any new PCIe adopter.”
