Sequans Communications introduced a new line of “EZLinkLTE” LTE modules based on its own LTE baseband chip. The modules include a complete RF front end and key interfaces in a single, compact package.
The first EZLinkLTE module, sampling now, is the VZ20Q, which is one of the first modules in the industry to support both LTE bands 4 and 13.
The baseband chip at the heart of the new module is Sequans’ SQN3120 Mont Blanc chip that was certified by Verizon Wireless in 2012. The chip is compliant with 3GPP release 9 and it delivers category 4 throughput of up to 150 Mbps in the downlink. Starting with the SQN3120 chip, the VZ20Q integrates all other elements necessary for a complete LTE modem system. These include an LTE-optimized RF transceiver provided by Sequans’ RF partner, Fujitsu Semiconductor, a complete dual-band RF front-end for bands 4 and 13, LP-DDR SDRAM, embedded boot Flash, and VC-TCXO, all in a single, surface-mountable package with a very compact footprint, 17 x 24 x 2 mm.
“Our EZLinkLTE modules provide great value to device designers in terms of cost savings and reduction of development risk and time,” said Georges Karam, Sequans CEO. “The EZLinkLTE modules are pre-integrated, pre-tested, and pre-certified by carriers, meaning that we’ve done most of the heavy lifting in advance and can offer device makers a very quick and easy solution for adding LTE connectivity to many types of devices.”
