Silicon photonics is advancing rapidly with new approaches in manufacturing.
This 60 minute webinar focuses on Silicon Photonics Co-Packaging and Manufacturing Techniques. We hear from IBM’s B. Alexander Janta-Polczynski and Vikas Gupta of GLOBALFOUNDRIES.
The manufacturing techniques for silicon photonics being developed by these partners have the potential to significantly reduce packaging costs for datacom, LiDAR & photonic computing applications — including at very high data rates of 800G.
