Sivers Photonics, imec, and ASM AMICRA successfully completed a wafer-scale integration of indium phosphide (InP) distributed feedback (DFB) lasers from Sivers’ InP100 platform onto imec’s silicon photonics platform (iSiPP).
Using ASM AMICRA’s latest NANO flip-chip bonder tool, the InP DFB laser diodes were bonded onto a 300mm silicon photonics wafer with an alignment precision within 500nm, enabling reproducible coupling of more than 10mW of laser power into the silicon nitride waveguides on the silicon photonics wafer. Supported by its partners, imec will offer this technology later in 2021 as a prototyping service, thereby accelerating the adoption of silicon photonics in a wide range of applications from optical interconnects, over LiDAR, to biomedical sensing.
Sivers says many silicon photonic systems today still rely on external light sources, owing to the lack of efficient on‐chip light sources. Silicon itself does not emit light efficiently and, therefore, light sources made of III-V semiconductors, such as indium phosphide (InP) or gallium arsenide (GaAs), are typically implemented as separately packaged components. These off‐chip lasers often suffer from higher coupling losses, a large physical footprint and a high packaging cost.
“We’re excited to work with imec and ASM AMICRA on the development of advanced integrated photonic components. The availability of tailored InP laser sources, designed and fabricated on our InP100 manufacturing platform, will boost the adoption of silicon photonic circuits for a wide variety of commercial applications ”, says Billy McLaughlin, Sivers Photonics Managing Director.
Joris van Campenhout, Optical I/O Program Director at imec: “We are very pleased to be working with Sivers Photonics and ASM AMICRA to extend our silicon photonics platform with hybrid integrated laser sources and amplifiers. This additional functionality will enable our joint customers to develop and prototype advanced photonic integrated circuits (PICs) with capabilities well beyond what we can offer today, in key areas such as datacom, telecom and sensing.”
Dr. Johann Weinhändler, ASM AMICRA Managing Director: “Our strength in high-precision placement seamlessly complements the expertise of all partners. With automated and ultra-precise flip-chip bonding, the way to high-volume manufacturing of these hybrid assemblies is open.”
