• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Saturday, April 11, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Staccato Signs Japanese Distributor for its UWB Silicon

Staccato Signs Japanese Distributor for its UWB Silicon

September 30, 2007
in Uncategorized
A A

Staccato Communications, a supplier of Ultra Wideband (UWB) wireless silicon, has signed Hakuto, a preeminent full service distributor, as their new Japanese distributor for the Ripcord family of single-chip, all-CMOS products. This distributor agreement follows Ripcord’s recently secured Japanese TELEC regulatory approval, enabling Staccato to deliver faster time-to-market with reduced risk for customers.

http://www.staccatocommunications.com

Tags: AllSilicon
ShareTweetShare
Previous Post

3Com to Be Acquired by Bain Capital Partners for $2.2 Billion

Next Post

Poland's Netia Deploys Juniper E320

Staff

Staff

Related Posts

Montage Technology Samples PCIe 6.x/CXL 3.x Retimer Chips
Data Centers

Montage Technology Samples PCIe 6.x/CXL 3.x Retimer Chips

January 22, 2025
Intel marks first EUV light at Fab 34 in Ireland
Semiconductors

Intel marks first EUV light at Fab 34 in Ireland

December 30, 2022
Blueprint: Building wholesale networks with OTN
All

Blueprint: Building wholesale networks with OTN

December 20, 2022
Huawei and Orange achieve 157 Tbps over 120km fiber link

Huawei and Orange achieve 157 Tbps over 120km fiber link

December 20, 2022
Oracle opens cloud region in Chicago
All

Oracle opens cloud region in Chicago

December 20, 2022
BT trials C-RAN in Leeds
All

BT trials C-RAN in Leeds

December 19, 2022
Next Post

OPNET Service Resolves Application Performance Problems

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version