Tag: Silicon

Mindspeed Technologies announced a high-performance, low-power physical media device (PMD) chipset that includes all necessary components required for CPRI-based optical ...

Tilera, a start-up based in San Jose, California, closed a $25 million series-C round of investment financing for its multicore ...

ZTE has selected Siverge Networks' flagship "Griffin" chip for use in multi-service and wireless backhauling products. The Griffin family of ...

DS, which supplies high-speed powerline and coax communications silicon, initiated a voluntary Concurso de Acreedores (similar to a Chapter 11 ...

T-Venture, the venture capital company of Deutsche Telekom, has made a strategic investment in Lantiq, which specializes in next-generation access ...

Texas Instruments unveiled a new System-on-a-Chip (SoC) architecture based on its multicore digital signal processors (DSPs) and designed for the ...

Broadcom announced a new chipset for Ethernet-based wireless and wired backhauling applications, as well as Ethernet-based business applications. The new ...

Aricent and Wintegra are collaborating on a joint LTE eNodeB testing solution. The solution will integrate software and components from ...

Beceem Communications announced plans for a single chip that integrates both LTE and WiMAX technology. The BCS500 multi-mode chip will ...

At last week's Mobile World Congress, Cavium Networks introduced its OCTEON multi-core MIPS64 processor solution for LTE eNodeB and Packet ...

Marvell introduced its Pantheon new platform for smartphone manufacturers. The company is aiming to significantly lower the bill of materials ...

LSI Corporation unveiled its next-generation link communication processor (LCP) for multiservice applications such as wireline access network, 2.5G/3G and 4G/LTE ...

Lantiq announced major additions to its DECT/CAT-iq portfolio, including the introduction of an end-to-end CAT-iq 2.0 home gateway and handset ...