Untether AI leverages at-memory computation for inference processing
Untether AI, a start-up based in Toronto, introduced its "tsunAImi" accelerator cards are powered by four of its own runAI200 ...
Tag: Silicon
Marvell intros automotive Gigabit Ethernet PHY with MACsec
Marvell introduced an automotive gigabit Ethernet PHY solution with integrated media access control security (MACsec).Marvell said MACsec will fortify in-vehicle ...
NVIDIA unveils DPUs and Data-Center-Infrastructure-on-a-Chip SDK
NVIDIA has begun sampling its second-generation family of BlueField data processing unit (DPUs) for accelerating data center infrastructure.The new BlueField-2 ...
U.S. DoD backs Intel for semiconductor packaging tech
The U.S. Department of Defense awarded a contract to Intel to enable the U.S. government to access Intel’s state-of-the-art semiconductor ...
Arm expands its Neoverse data center server CPU porfolio
Arm is unveiling two new platforms in its Neoverse silicon portfolio for data centers CPUs: the Arm Neoverse V1 platform, delivering ...
DARPA’s Electronics Resurgence Initiative signs Arm
Arm today announced a three-year partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA), establishing an access framework ...
Fungible announces its DPU for scale-out data centers
Fungible, a start-up based in San Jose, California, unveiled its Fungible Data Processing Unit (Fungible DPU), a microprocessor optimized for ...
SiFive and Innovium enter collaboration
SiFive and Innovium, announced a collaboration to drive faster innovation in switch silicon solutions. SiFive specializes in RISC-V processor IP ...
MediaTek intros 5G chip supporting dual SIM
MediaTek introduced its Dimensity 800U 5G SoC, designed for multi-core high performance and leading 5G+5G Dual Sim Dual Standby (DSDS) ...
Lightmatter is developing a photonic processor
Lightmatter, a start-up based in Boston, will unveil plans for an artificial intelligence (AI) photonic processor. Lightmatter said its general-purpose ...
Samsung implements “X-Cube” 3D IC packaging in 7nm and 5nm
Samsung Electronics announced the immediate availability of its 3D IC packaging technology, eXtended-Cube (X-Cube). "Samsung's new 3D integration technology ensures ...
SiFive raises $61 million for RISC-V
SiFive, a start-up specializing in RISC-V processor IP and silicon solutions, raised $61 million in a Series E round. SiFive, ...
Marvell appoints AT&T’s Marachel Knight to its Board
Marvell announced the appointment of Marachel Knight, SVP of Engineering and Operations of AT&T to its board of directors. Knight's ...
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