ITU-T Advances G.hnem Recommendations
The G.hnem standard has entered the final stages of approval at the International Telecommunications Union (ITU). G.hnem will leverage low ...
The G.hnem standard has entered the final stages of approval at the International Telecommunications Union (ITU). G.hnem will leverage low ...
Toshiba America Electronic Components introduced "SmartNAND", its next-generation 24-nanometer (nm) NAND flash product family featuring a control chip that supports ...
Vitesse Semiconductor and AppliedMicro announced an alliance to drive a standard approach for 40G and 100G Enhanced Forward Error Correction ...
AppliedMicro announced the availability of "Diamondback" APM86392 and APM86391, the newest members of its PacketPro™ family of multi-core embedded processing ...
Discera announced the availability of its high performance DSC21XX I2C and DSC22XX SPI application programmable MEMS oscillators. The devices are ...
Broadcom introduced its latest StrataXGS Ethernet switching chip optimized for high-capacity mobile backhaul platforms. The StrataXGS BCM56440 switch, which is ...
Texas Instruments has selected Integrated Device Technology's (IDT's) CPS-1616 RapidIO Gen2 switch for its new TMDXEVM6616 evaluation module (EVM) for ...
Samsung Electronics Co. announced first production of four gigabit (Gb), low power double-data-rate 2 (LPDDR2) DRAM using 30 nanometer (nm) ...
NetLogic Microsystems will acquire Optichron, a privately-held, fabless semiconductor provider of 3G/4G LTE base station digital front-end (DFE) processors, for ...
Broadcom will acquire Provigent, a privately-held silicon developer with solution for microwave backhaul systems, for approximately $313 million in cash. ...
Xilinx has begun sampling its Kintex-7 K325T Field Programmable Gate Array (FPGA), marking the industry's fastest product rollout of next ...
NetLogic Microsystems supplied several key innovations in high-speed physical layer SerDes development that resulted in the world's lowest latency 10 ...
GE's Global Research Center is developing an advanced thermal substrate with better heat dissipation properties than copper. The development of ...
© 2025 Converge Digest - A private dossier for networking and telecoms.
© 2025 Converge Digest - A private dossier for networking and telecoms.