Alphawave Semi Tapes Out UCIe 3D Chiplet on TSMC
lphawave Semi has completed the tape-out of its UCIe™ 3D chiplet IP on TSMC’s SoIC-X platform, delivering up to 10x ...
Tag: TSMC
Alchip and Ayar Labs Team on Co-Packaged Optics
Alchip Technologies and Ayar Labs introduced a co-packaged optics (CPO) solution aimed at breaking copper interconnect bottlenecks in large-scale AI ...
Cadence Expands TSMC Partnership with AI-Driven Design
Cadence announced a major expansion of its collaboration with TSMC to accelerate AI and HPC semiconductor design, covering advanced EDA ...
Alphawave Semi Tapes Out 64 Gbps UCIe Gen3 on TSMC 3nm
Alphawave Semi announced the tapeout of its 64 Gbps UCIe Gen3 IP subsystem on TSMC’s 3nm (N3P) process, setting a ...
TSMC and University of Tokyo Launch Joint Semiconductor Lab
TSMC and the University of Tokyo have inaugurated the “TSMC-UTokyo Lab,” marking TSMC’s first joint research facility with a university ...
TSMC Ushers in Angstrom Era with A14 Process and Silicon Photonics Integration
TSMC introduced its next-generation A14 logic process at the North America Technology Symposium in Santa Clara, California, outlining a significant ...
Synopsys and TSMC Accelerate Angstrom-Scale Design with A16, N2P
Synopsys and TSMC have expanded their long-standing collaboration with certified EDA flows and IP solutions for the latest angstrom-scale nodes, ...
Marvell Previews 2nm Silicon with TSMC
Marvell announced its first 2nm silicon IP, developed on TSMC’s advanced 2nm process, marking a major step in AI and ...
TSMC Secures $6.6 Billion in CHIPS Funding for Arizona Semiconductor Expansion
The U.S. Department of Commerce has awarded TSMC Arizona up to $6.6 billion in direct funding under the CHIPS Incentives ...
Silicon Photonics Industry Alliance Gets Underway, Backed by TSMC
A newly formed Silicon Photonics Industry Alliance (SiPhIA), spearheaded by SEMI alongside TSMC and ASE, aims to accelerate next-generation semiconductor ...
ESMC Breaks Ground on €10 Billion Semiconductor Fab in Dresden
ESMC, a joint venture between TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V., has officially begun the ...
ESMC Breaks Ground on €10 Billion Semiconductor Fab in Dresden
ESMC, a joint venture between TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V., has officially begun the ...
Alphawave Semi tapes out multi-protocol I/O connectivity chiplet
Alphawave Semi has announced the successful tape-out of the industry’s first off-the-shelf multi-protocol I/O connectivity chiplet, utilizing TSMC’s 7nm process. ...
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