• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Sunday, April 12, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » TDK invests in Singapore’s Silicon Box for chiplet fabrication

TDK invests in Singapore’s Silicon Box for chiplet fabrication

January 7, 2024
in Semiconductors
A A

TDK Ventures, Inc. has invested in Silicon Box, a start-up based in Singapore that is focused on semiconductor chiplet packaging design and fabrication.

Silicon Box was co-founded Dr. Sehat Sutardja and Weili Dai, who previously founded Marvell, along with Dr. Byung Joon (BJ) Han, who was formerly CEO of STATS ChipPAC (acquired by JCET in 2015). 

Silicon Box says its innovative, large format semiconductor package design and fabrication method enables up to 8x more chiplet devices per production unit, with 90+% yield – compared to industry alternatives, which top out around 60%.

TDK Ventures’ President Nicolas Sauvage commented, “TDK Ventures is excited to partner with the world-class team at Silicon Box. Their standout chiplet design is making waves in the industry, and they dalready have a proven concept in a 750,000 square foot facility to support production. We are ommitted to supporting their success for a positive impact on the world.”

Silicon Box CEO Dr. BJ Han also discussed the partnership saying, “Teaming with TDK Ventures is ideal for us, and we are looking forward to continuing what has already been an incredible collaboration. We have significant synergies with many of their business units, and in addition to their investment, we are excited to engage with their extensive network, subject matter experts, and industrial base. Bring on the TDK Goodness!”

Source: TDK Ventures
Tags: Silicon BoxSingapore
ShareTweetShare
Previous Post

Sparkle’s GreenMed Submarine Cable Project Underway

Next Post

Maxlinear’s Puma 8  cable modem delivers 10G for MSOs

Jim Carroll

Jim Carroll

Editor and Publisher, Converge! Network Digest, Optical Networks Daily - Covering the full stack of network convergence from Silicon Valley

Related Posts

Candle Submarine Cable to Deliver 24 Fiber Pairs Across Asia-Pacific by 2028
Subsea

Candle Submarine Cable to Deliver 24 Fiber Pairs Across Asia-Pacific by 2028

September 22, 2025
Singapore’s DayOne Bets Big on 128MW Hyperscale Campus in Finland
Data Centers

Singapore’s DayOne Bets Big on 128MW Hyperscale Campus in Finland

August 17, 2025
DC BLOX to Build New Subsea Cable Landing Station in Palm Coast, Florida
Subsea

Nokia Delivers 20.8 Tbps Subsea Capacity on Indonesia-Singapore Cable

July 31, 2025
Semiconductor Industry Association projects rapid expansion in U.S. capacity
Semiconductors

GlobalFoundries Partners with Singapore’s A*STAR of Packaging R&D

May 20, 2025
Rain Tree Photonics Launches 200G/Lane Silicon Photonics 
Optical

Rain Tree Photonics Launches 200G/Lane Silicon Photonics 

March 28, 2025
Equinix expands to Indonesia
5G / 6G / Wi-Fi

Singtel Expands 5G+ with First 700 MHz Deployment in Singapore

February 10, 2025
Next Post
Maxlinear’s Puma 8  cable modem delivers 10G for MSOs

Maxlinear’s Puma 8  cable modem delivers 10G for MSOs

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version