TE Connectivity (TE) is the first to launch micro Quad Small Form-Factor Pluggable (microQSFP) input/output (I/O) interconnects.
The microQSFP connectors are the next step forward in high-density faceplates for data center infrastructure. MicroQSFP connectors deliver QSFP28 functionality in a smaller, generally SFP-sized form factor while providing significantly better thermal performance to help save energy costs, improved electrical performance at 25 gigabits per second (Gbps) and 33 percent higher density than QSFP to fit more ports on a standard line card.
The new microQSFP connectors deliver 56Gbps performance with backward compatibility to 28Gbps to support next generation designs. Built-in fins on TE’s new connectors eliminate the need for additional clips and heatsinks and allow faceplate airflow to the interior of the equipment, which helps microQSFP deliver significantly better thermal performance than QSFP28 and other leading solutions.
TE is a member of the microQSFP Multi Source Agreement (MSA) group, which is working to build an industry-wide ecosystem for microQSFP, and ensuring that products can be easily adopted and integrated into existing data center designs.
“At a time when faceplate real estate and thermal performance are at a premium, TE’s microQSFP products deliver on both counts,” said Phil Gilchrist, CTO, TE Data and Devices. “The technological innovations of TE’s microQSFP products can revolutionize the industry by enabling customers to place up to 72 ports of 100 Gbps each on a 1RU line card.”
http://www.te.com/microqsfp
