TeraSignal, a start-up based in Irvine, California, introduced TSLink, an intelligent chip-to-module (C2M) interconnect designed to revolutionize data transmission between large ASICs and linear optical modules. TSLink eliminates the need for digital signal processors (DSPs) by leveraging existing microcontroller resources in optical modules, automating link training and performance monitoring.
TeraSignal says its innovation reduces power consumption by 50% and minimizes latency, offering a plug-and-play solution tailored for AI and high-performance computing environments.
TSLink taps into DSP-based SerDes functionality in AI ASICs and GPUs to optimize performance across protocols like Ethernet and PCIe, as well as modulation schemes such as NRZ and PAM4. The platform enables connectivity across various optical solutions, including linear pluggable optics (LPO), co-packaged optics (CPO), and active copper cables (ACC). With its protocol-agnostic design, TSLink ensures high flexibility and adaptability for different data transmission needs, while reducing the complexity typically associated with traditional high-speed interconnects.
By embedding discrete-time signal processing algorithms directly into the interconnect, TSLink ensures optimal signal integrity, lower bit error rates, and reduced latency. Its compact design eliminates the need for DSPs, reducing the silicon die size by 50%.
TeraSignal is now offering TSLink reference designs, including firmware and the TS8401/02 Intelligent Re-Driver, to select partners and customers, with broader availability expected later this year.
• TSLink automates link training and monitoring, reducing power consumption by 50%.
• The solution eliminates the need for DSPs, improving latency and signal integrity.
• TSLink supports protocols like Ethernet, PCIe, and InfiniBand, along with modulation schemes NRZ and PAM4.
• Designed for high-performance AI and compute environments, TSLink works with LPO, CPO, and ACC solutions.
• TeraSignal offers TSLink reference designs, with broader availability expected by year-end.
“TSLink is architected to unlock the full potential of modern high-speed interconnects by embedding intelligence directly into the C2M connection, minimizing power consumption and latency while ensuring optimal link performance,” said Dr. Armond Hairapetian, Founder and CEO of TeraSignal.
