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Home » Texas Instruments Debuts Carrier Infrastructure Platform

Texas Instruments Debuts Carrier Infrastructure Platform

January 29, 2006
in Uncategorized
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Texas Instruments introduced new DSP-based carrier infrastructure platform designed for fixed and mobile communications applications. The new systems on chip (SOC), which is example in the second half of 2006, will be capable of delivering multimedia/3G services, such as fixed-mobile-convergence, within an IP multimedia services (IMS) environment.

TI’s new carrier infrastructure platform is comprised of three elements — silicon, software and reference designs that include evaluation modules.

The silicon architecture expands on that of the company’s previous VoIP infrastructure products, offering even higher solution density and the ability to support a greater breadth of applications, like video processing. The new processor is based on the company’s TMS320C64x+ core.

The second element of this platform includes the company’s widely-deployed Telogy voice software as well as a rich library of software modules designed to support the needs of fixed, mobile and cable network equipment manufacturers. These elements will address a variety of standards and technologies, including those features and functions required for Class 4 and Class 5 replacement, PacketCable 1.5, modem/fax transmission, wireless transcoding applications, wireless media gateways, wireless trunking, encryption, redundancy, diagnostics and service enhancements. TI is also working with key value-added third parties to offer complementary solutions.

The third element of this platform is a fully functional evaluation module.

http://www.ti.com/cis

  • Earlier this month, Texas Instruments introduced a scheme that leverages its digital signal processor (DSP) technology and embedded software solutions to monitor and improve the quality of IP-based services, such as voice, data and video. TI’s new “PIQUA” utilizes real-time calculations to instantly assess quality parameters related to the user’s experience, allowing both equipment manufacturers and service providers to dynamically adapt to changing conditions and make adjustments which today are either impossible or done manually. These quality management tools enable the discovery, monitoring and repair of services, devices and networks, allowing operators to proactively manage factors like echo, dropped-packets and line-delay.
  • In September 2005, Texas Instruments unveiled its DSP-based DaVinci silicon technology aimed at next generations of digital video products. The DaVinci product portfolio, which will include processors, software, tools and partnership solutions, addresses digital video requirements across a range of applications, including video security, IP set-top boxes, video conferencing, automobile infotainment, portable media players and digital cameras. DaVinci processors, some of which are already on the market, consist of combinations of DSP and ARM cores, memory configurations, video accelerators, and peripheral interfaces for specific applications. DaVinci silicon is based on the new TMS320C64x+ core and it is code compatible with TI�s TMS320C64x DSPs. TI will support a full range of audio, video and imaging codecs. A key feature of the DaVinci portfolio will be common Application Programming Interfaces (APIs) to accelerate the development of new consumer products. APIs will make it easier for OEMs to develop interoperable code that will work with other DaVinci-based applications. TI is also developing an en-to-end video ecosystem through a range of partners. Over the coming year, TI and its third parties plan to introduce a large number of products, including multiple development platforms, reference designs, software and silicon based on DaVinci technology.
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