Texas Instruments (TI) introduced the “WiLink” mobile Wireless LAN (mWLAN) platform, which includes single-chip solutions aimed at driving Voice over WLAN (VoWLAN) into mainstream mobile phones. Currently, WLAN and VoWLAN capabilities are found in high-end mobile phones primarily aimed at enterprise users. TI said its the WiLink solution would deliver the performance, small size and price-point required by OEMs to provide cellular-WLAN phones and converged devices to consumers.
TI’s WiLink solution is comprised of hardware and software optimized for mobile phones providing on-the-go voice access over a WLAN or cellular network. The WiLink 4.0 mWLAN platform, TI’s fourth generation mWLAN solution, consists of two different options to meet a variety of marketplace needs. Manufacturers can choose between the TNETW1251 WiLink 4.0 802.11b/g single chip or the TNETW1253 WiLink 4.0 802.11a/b/g single chip. The platform includes a WiLink 4.X Software Development Kit (SDK).
The WiLink 4.0 TNETW1251 and TNETW1253 single-chip solutions are the industry’s first WLAN products manufactured in a 90nm advanced RF-CMOS process and leverage TI’s DRP technology. The devices are expected to sample in Q3 2005. Products integrating TI’s WiLink 4.0 platform are expected to be released to market in Q2 2006.
http://www.ti.com
