Mitsubishi Heavy Industries (MHI), NTT Communications (NTT Com), and NEC Networks & System Integration Corporation (NESIC) are set to begin testing two-phase direct-to-chip cooling systems in December. The test will retrofit high-performance servers with these cooling systems in an operational air-cooled data center in Tokyo. This initiative, supported by the Tokyo Metropolitan Government, aims to enhance cooling efficiency, reduce server energy consumption, and cut CO2 emissions without significant facility upgrades.
The demonstration addresses growing demands for high-performance processors, such as GPUs used in generative AI and other technologies, which require greater cooling capacity. Two-phase direct-to-chip cooling circulates an insulating refrigerant through cold plates attached to server processors, efficiently dissipating heat without the risk of water damage. NESIC will handle server integration and testing, while NTT Com provides the data center environment. MHI leads the project and supplies the cooling technology.
The companies aim to demonstrate that this solution can accommodate high-performance servers in legacy data centers while minimizing capital investment. The test aligns with broader goals to promote sustainable technologies and support carbon-neutral initiatives in the data center industry.
• Key Points:
• Project begins December 2024 at a Tokyo-based air-cooled data center operated by NTT Com.
• Two-phase direct-to-chip cooling uses a non-water-based refrigerant, reducing risk and boosting efficiency.
• MHI supplies the cooling systems; NESIC oversees server procurement and testing.
• This initiative is part of Tokyo’s program to accelerate GX-related industry technologies.
• The project focuses on retrofitting existing data centers to meet rising demands for AI and GPU processing.
