TSMC confirmed plans to build and operate an advanced semiconductor fab in Arizona — its secend manufacturing site in the United States. The company already operates a fab in Camas, Washington and design centers in Austin and San Jose.
The new facility in Arizona represents a $12 billion investment. It will utilize TSMC’s 5-nanometer technology for semiconductor wafer fabrication, have a 20,000 semiconductor wafer per month capacity.
TSMC said the fabrication facility will create over 1,600 high-tech professional jobs directly, and thousands of indirect jobs in the semiconductor ecosystem. Construction is planned to start in 2021 with production targeted to begin in 2024.
TSMC cited a strong partnership with the U.S. administration and the State of Arizona on this project.
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- TSMC is expected to ramp 5nm production in Taiwan beginning in Q2
- TSMC’s 2020 current production capacity is approximately 12 million wafers
